AT21CS01-WWU11M10-T
vs
AT21CS01-U11M10-B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
DIE,
WLCSP-4
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Date Of Intro
2017-10-09
2017-10-09
JESD-30 Code
X-XUUC-N
R-PBGA-B4
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Organization
128X8
128X8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
VFBGA
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
SERIAL
SERIAL
Screening Level
ISO/TS-16949
ISO/TS-16949
Serial Bus Type
1-WIRE
1-WIRE
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
BALL
Terminal Position
UPPER
BOTTOM
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
1
Rohs Code
Data Retention Time-Min
100
Endurance
1000000 Write/Erase Cycles
Number of Ports
1
Number of Terminals
4
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
BGA4,2X2,16
Page Size
8 words
Reverse Pinout
NO
Seated Height-Max
0.355 mm
Standby Current-Max
0.0000015 A
Temperature Grade
INDUSTRIAL
Terminal Pitch
0.4 mm
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Compare AT21CS01-U11M10-B with alternatives