AT21CS01-WWU11M10-B
vs
AT21CS01-UUM10-B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
DIE,
VFBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Date Of Intro
2017-10-09
2017-10-09
JESD-30 Code
X-XUUC-N
R-PBGA-B4
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Organization
128X8
128X8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
VFBGA
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
SERIAL
SERIAL
Screening Level
ISO/TS-16949
ISO/TS-16949
Serial Bus Type
1-WIRE
1-WIRE
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
NO LEAD
BALL
Terminal Position
UPPER
BOTTOM
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
1
Number of Terminals
4
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Seated Height-Max
0.355 mm
Temperature Grade
INDUSTRIAL
Terminal Pitch
0.4 mm
Compare AT21CS01-WWU11M10-B with alternatives
Compare AT21CS01-UUM10-B with alternatives