AT17N512-10SJ
vs
XC1701-SO20C
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
XILINX INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP,
|
SOP,
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.51
|
|
Clock Frequency-Max (fCLK) |
10 MHz
|
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e3
|
e0
|
Length |
12.8 mm
|
12.827 mm
|
Memory Density |
524288 bit
|
1048576 bit
|
Memory IC Type |
CONFIGURATION MEMORY
|
CONFIGURATION MEMORY
|
Memory Width |
1
|
1
|
Moisture Sensitivity Level |
2
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Number of Words |
524288 words
|
1048576 words
|
Number of Words Code |
512000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512KX1
|
1MX1
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.64 mm
|
2.6416 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.5 mm
|
7.5184 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Additional Feature |
|
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AT17N512-10SJ with alternatives
Compare XC1701-SO20C with alternatives