AT17N010-10CI
vs
ATFS10-CU
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
|
Package Description |
SON, SOLCC8,.25
|
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Clock Frequency-Max (fCLK) |
10 MHz
|
|
Data Retention Time-Min |
20
|
90
|
Endurance |
10 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
JESD-30 Code |
S-XDSO-N8
|
R-PDSO-N8
|
JESD-609 Code |
e0
|
e3
|
Length |
5.99 mm
|
|
Memory Density |
1048576 bit
|
524288 bit
|
Memory IC Type |
CONFIGURATION MEMORY
|
EEPROM CARD
|
Memory Width |
1
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
|
Number of Terminals |
8
|
8
|
Number of Words |
1048576 words
|
|
Number of Words Code |
1000000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
1MX1
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
SON
|
SON
|
Package Equivalence Code |
SOLCC8,.25
|
SOLCC8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.14 mm
|
|
Standby Current-Max |
0.0001 A
|
0.0001 A
|
Supply Current-Max |
0.005 mA
|
0.005 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
5.99 mm
|
|
Base Number Matches |
1
|
1
|
Programming Voltage |
|
2.7 V
|
|
|
|
Compare AT17N010-10CI with alternatives
Compare ATFS10-CU with alternatives