AT17F040-30JL
vs
XCF04SVO20CES
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
XILINX INC
|
| Part Package Code |
LPCC
|
TSSOP
|
| Package Description |
QCCJ,
|
TSSOP,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.1.B.1
|
3A991.B.1.B.1
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
33 MHz
|
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8.9662 mm
|
6.5024 mm
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
CONFIGURATION MEMORY
|
CONFIGURATION MEMORY
|
| Memory Width |
1
|
1
|
| Moisture Sensitivity Level |
2
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
4MX1
|
4MX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
1.19 mm
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.97 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.9662 mm
|
4.4 mm
|
| Write Cycle Time-Max (tWC) |
0.03 ms
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare AT17F040-30JL with alternatives
Compare XCF04SVO20CES with alternatives