ASM4SSTVF16859-56QT
vs
IDT74SSTV16859NLG8
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALLIANCE SEMICONDUCTOR CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
DFN
|
DFN
|
Package Description |
HVQCCN,
|
HVQCCN, LCC56,.31SQ,20
|
Pin Count |
56
|
56
|
Manufacturer Package Code |
MLF
|
MLF
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
SSTV
|
SSTV
|
JESD-30 Code |
S-PQCC-N56
|
S-PQCC-N56
|
JESD-609 Code |
e0
|
e3
|
Length |
8 mm
|
8 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Number of Bits |
13
|
13
|
Number of Functions |
1
|
1
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC56,.31SQ,20
|
LCC56,.31SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Propagation Delay (tpd) |
2.8 ns
|
2.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
8 mm
|
8 mm
|
fmax-Min |
210 MHz
|
200 MHz
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Technology |
|
TTL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ASM4SSTVF16859-56QT with alternatives
Compare IDT74SSTV16859NLG8 with alternatives