ASM3P2811AF-08SR
vs
CY25812ZC
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, SOIC-8
|
TSSOP, TSSOP8,.25
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
751-07
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
4.9 mm
|
4.4 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Clock Frequency-Max |
40 MHz
|
64 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP8,.25
|
TSSOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Primary Clock/Crystal Frequency-Nom |
40 MHz
|
32 MHz
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Current-Max |
18 mA
|
27.2 mA
|
| Supply Voltage-Max |
3.6 V
|
3.63 V
|
| Supply Voltage-Min |
3 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.91 mm
|
3 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare ASM3P2811AF-08SR with alternatives
Compare CY25812ZC with alternatives