AS9C25256M2018L-166TC vs IDT70V7319S133DDG feature comparison

AS9C25256M2018L-166TC Integrated Silicon Solution Inc

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IDT70V7319S133DDG Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description LFQFP, LFQFP,
Pin Count 144 144
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 15 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code S-PQFP-G144 S-PQFP-G144
JESD-609 Code e0 e3
Length 20 mm 20 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 144 144
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 2.6 V 3.45 V
Supply Voltage-Min (Vsup) 2.4 V 3.15 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 20 mm 20 mm
Base Number Matches 1 2

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Compare IDT70V7319S133DDG with alternatives