AS9C25256M2018L-166FC
vs
70T633S12BF
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALLIANCE SEMICONDUCTOR CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
BGA
|
CABGA
|
Package Description |
LFBGA,
|
|
Pin Count |
208
|
208
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.B.2.A
|
NLR
|
HTS Code |
8542.32.00.41
|
8542320041
|
Access Time-Max |
10 ns
|
12 ns
|
Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
|
JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
JESD-609 Code |
e0
|
e0
|
Length |
15 mm
|
15 mm
|
Memory Density |
4718592 bit
|
9437184 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
18
|
18
|
Number of Functions |
1
|
1
|
Number of Terminals |
208
|
208
|
Number of Words |
262144 words
|
524288 words
|
Number of Words Code |
256000
|
512000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256KX18
|
512KX18
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.5 mm
|
Supply Voltage-Max (Vsup) |
2.6 V
|
2.6 V
|
Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
15 mm
|
15 mm
|
Base Number Matches |
1
|
6
|
Pbfree Code |
|
No
|
Manufacturer Package Code |
|
BF208
|
Samacsys Manufacturer |
|
Renesas Electronics
|
I/O Type |
|
COMMON
|
Moisture Sensitivity Level |
|
3
|
Number of Ports |
|
2
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
BGA208,17X17,32
|
Peak Reflow Temperature (Cel) |
|
225
|
Standby Current-Max |
|
0.01 A
|
Standby Voltage-Min |
|
2.4 V
|
Supply Current-Max |
|
0.355 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare AS9C25256M2018L-166FC with alternatives
Compare 70T633S12BF with alternatives