AS8SLC128K32P-25L/IT vs P4C164L-100LCLF feature comparison

AS8SLC128K32P-25L/IT Micross Components

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P4C164L-100LCLF Pyramid Semiconductor Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROSS COMPONENTS PYRAMID SEMICONDUCTOR CORP
Part Package Code PGA QLCC
Package Description PGA, PGA66,11X11 0.350 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-28
Pin Count 66 28
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 100 ns
I/O Type COMMON
JESD-30 Code S-XPGA-P66 R-CQCC-N28
JESD-609 Code e0
Length 27.305 mm 13.97 mm
Memory Density 4194304 bit 65536 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 32 8
Number of Functions 1 1
Number of Terminals 66 28
Number of Words 131072 words 8192 words
Number of Words Code 128000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX32 8KX8
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code PGA QCCN
Package Equivalence Code PGA66,11X11
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.953 mm 1.905 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form PIN/PEG NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Width 27.305 mm 8.89 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Current-Max 0.125 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AS8SLC128K32P-25L/IT with alternatives

Compare P4C164L-100LCLF with alternatives