AS8S512K32Q1-55L/883
vs
WS512K32-55G2LC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROSS COMPONENTS
WHITE ELECTRONIC DESIGNS CORP
Package Description
QFP,
22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-CQFP-G68
S-CQFP-G68
Length
22.352 mm
22.36 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
512KX32
512KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
22.352 mm
22.36 mm
Base Number Matches
1
3
Rohs Code
Additional Feature
USER CONFIGURABLE AS 2M X 8
Alternate Memory Width
16
I/O Type
COMMON
JESD-609 Code
e4
Output Characteristics
3-STATE
Package Equivalence Code
QFP68,.99SQ,50
Qualification Status
Not Qualified
Standby Current-Max
0.028 A
Standby Voltage-Min
2 V
Supply Current-Max
0.66 mA
Terminal Finish
GOLD
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