AS8S512K32Q1-55/XT
vs
WS512K32-55G2LCA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROSS COMPONENTS
MICROSEMI CORP
Part Package Code
QFP
QFP
Package Description
QFP, QFP68,.99SQ,50
22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Pin Count
68
68
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
JESD-30 Code
S-CQFP-G68
S-CQFP-G68
JESD-609 Code
e0
Length
22.352 mm
22.36 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
512KX32
512KX32
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Equivalence Code
QFP68,.99SQ,50
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.1 mm
Standby Current-Max
0.08 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.55 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
22.352 mm
22.36 mm
Base Number Matches
1
3
Additional Feature
USER CONFIGURABLE AS 2M X 8
Alternate Memory Width
16
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AS8S512K32Q1-55/XT with alternatives
Compare WS512K32-55G2LCA with alternatives