AS8S512K32P-35/Q
vs
5962-9461114HMX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROSS COMPONENTS
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
PGA
Package Description
PGA,
CERAMIC, QFP-68
Pin Count
66
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
25 ns
JESD-30 Code
S-CPGA-P66
S-CQFP-G68
JESD-609 Code
e0
e0
Length
27.305 mm
22.352 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
66
68
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX32
512KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
QFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.5974 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
PERPENDICULAR
QUAD
Width
27.305 mm
22.352 mm
Base Number Matches
1
5
Screening Level
MIL-STD-883
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