Findchips: Compare AS8S512K32P-35/Q vs 5962-9318712HNC

AS8S512K32P-35/Q vs 5962-9318712HNC feature comparison

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Pbfree Code	No
Rohs Code	No
Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	MICROSS COMPONENTS	AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code	PGA
Package Description	PGA,	PGA, PGA66,11X11
Pin Count	66
Reach Compliance Code	compliant	unknown
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.32.00.41	8542.32.00.41
Access Time-Max	35 ns	55 ns
JESD-30 Code	S-CPGA-P66	S-XPGA-P66
JESD-609 Code	e0
Length	27.305 mm
Memory Density	16777216 bit	4194304 bit
Memory IC Type	SRAM MODULE	SRAM MODULE
Memory Width	32	32
Number of Functions	1
Number of Terminals	66	66
Number of Words	524288 words	131072 words
Number of Words Code	512000	128000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	512KX32	128KX32
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC
Package Code	PGA	PGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	4.5974 mm
Supply Voltage-Max (Vsup)	5.5 V
Supply Voltage-Min (Vsup)	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Finish	TIN LEAD
Terminal Form	PIN/PEG	PIN/PEG
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	PERPENDICULAR	PERPENDICULAR
Width	27.305 mm
Base Number Matches	1	3
I/O Type		COMMON
Output Characteristics		3-STATE
Package Equivalence Code		PGA66,11X11
Screening Level		38535Q/M;38534H;883B
Standby Voltage-Min		2 V
Supply Current-Max		0.6 mA
	Memory » SRAMs	Memory » SRAMs