AS8FLC1M32BQT-70/XT
vs
WEDF1M32B-90G2UC5
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROSS COMPONENTS
MICROSEMI CORP
Part Package Code
QFP
QFP
Package Description
CERAMIC, QFP-68
0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68
Pin Count
68
68
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
90 ns
Additional Feature
BOTTOM BOOT BLOCK
USER CONFIGURABLE AS 4M X 8
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
S-CQFP-G68
S-CQFP-G68
JESD-609 Code
e0
e4
Length
22.352 mm
22.36 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Sectors/Size
1,2,1,15
Number of Terminals
68
68
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
1MX32
1MX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Equivalence Code
QFP68,.99SQ,50
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
4.57 mm
Sector Size
16K,8K,32K,64K
Standby Current-Max
0.00015 A
Supply Current-Max
0.14 mA
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Type
NOR TYPE
NOR TYPE
Width
22.352 mm
22.36 mm
Base Number Matches
1
3
Alternate Memory Width
16
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
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