AS8FLC1M32BQ-100/Q vs 5962-0920502HXC feature comparison

AS8FLC1M32BQ-100/Q Micross Components

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5962-0920502HXC Micross Components

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Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROSS COMPONENTS AUSTIN SEMICONDUCTOR INC
Part Package Code QFP QFP
Package Description HERMETIC SEALED, CERAMIC, QFP-68 QFP, QFP68,.99SQ,50
Pin Count 68 68
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 100 ns
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM BOTTOM
JESD-30 Code R-CQFP-G68 S-XQFP-G68
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH MODULE
Memory Width 32 32
Number of Functions 1
Number of Terminals 68 68
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1MX32 1MX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code QFP QFP
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q 38535Q/M;38534H;883B
Seated Height-Max 3.556 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS HYBRID
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
Data Polling YES
Number of Sectors/Size 1,2,1,15
Package Equivalence Code QFP68,.99SQ,50
Sector Size 4K,2K,8K,16K
Standby Current-Max 0.00025 A
Supply Current-Max 0.14 mA
Toggle Bit NO

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Compare 5962-0920502HXC with alternatives