AS8C803625A-QC75N
vs
71V65703S75PFG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ALLIANCE MEMORY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
TQFP
Package Description
LQFP,
TQFP-100
Pin Count
100
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Samacsys Manufacturer
Alliance Memory
Access Time-Max
7.5 ns
7.5 ns
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
Length
20 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX36
256KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
Base Number Matches
1
2
Manufacturer Package Code
PKG100
Additional Feature
FLOW-THROUGH
JESD-609 Code
e3
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare AS8C803625A-QC75N with alternatives
Compare 71V65703S75PFG8 with alternatives