AS8C803600-QC150N
vs
71V67603ZS150PFI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ALLIANCE MEMORY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
14 X 20 MM, LEAD FREE, PLASTIC, MO-136DJ, TQFP-100
QFP, QFP100,.63X.87
Pin Count
100
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.8 ns
3.8 ns
Additional Feature
PIPELINED ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
Length
20 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
ZBT SRAM
STANDARD SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Terminals
100
100
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX36
256KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
20
Width
14 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
150 MHz
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63X.87
Standby Current-Max
0.07 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.325 mA
Terminal Finish
Tin/Lead (Sn85Pb15)
Compare AS8C803600-QC150N with alternatives
Compare 71V67603ZS150PFI with alternatives