AS7C33512PFS16A-100BC vs GS78116AGB-10 feature comparison

AS7C33512PFS16A-100BC Alliance Semiconductor Corporation

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GS78116AGB-10 GSI Technology

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Rohs Code No Yes
Part Life Cycle Code Transferred End Of Life
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, BGA,
Pin Count 119 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 10 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e1
Length 22 mm 22 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.99 mm
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 4
Pbfree Code Yes
Samacsys Manufacturer GSI TECHNOLOGY
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

Compare AS7C33512PFS16A-100BC with alternatives

Compare GS78116AGB-10 with alternatives