AS7C332MNTD18A-167TQCN
vs
AS7C252MNTD18A-133TQC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALLIANCE SEMICONDUCTOR CORP
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
LQFP, QFP100,.63X.87
LQFP, QFP100,.63X.87
Pin Count
100
100
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
3.8 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
167 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e3
e0
Length
20 mm
20 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX18
2MX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP100,.63X.87
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.06 A
0.06 A
Standby Voltage-Min
3.14 V
2.38 V
Supply Current-Max
0.35 mA
0.325 mA
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
2
2
Compare AS7C332MNTD18A-167TQCN with alternatives
Compare AS7C252MNTD18A-133TQC with alternatives