AS7C33256NTF18B-10TQC vs MT58L256L18F1T-8.5IT feature comparison

AS7C33256NTF18B-10TQC Alliance Semiconductor Corporation

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MT58L256L18F1T-8.5IT Micron Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP MICRON TECHNOLOGY INC
Part Package Code QFP QFP
Package Description LQFP, PLASTIC, MS-026BHA, TQFP-100
Pin Count 100 100
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 8.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX18 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 2 2
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63X.87
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.325 mA

Compare AS7C33256NTF18B-10TQC with alternatives

Compare MT58L256L18F1T-8.5IT with alternatives