AS7C33256NTD32A-166TQIN
vs
MT58L256L32PT-6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALLIANCE SEMICONDUCTOR CORP
MICRON TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
LQFP, QFP100,.63X.87
PLASTIC, TQFP-100
Pin Count
100
100
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.8 ns
3.5 ns
Additional Feature
PIPELINED ARCHITECTURE; LATE WRITE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e3
e0
Length
20 mm
20 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
ZBT SRAM
CACHE SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
256KX32
256KX32
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP100,.63X.87
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.03 A
0.01 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.475 mA
0.45 mA
Supply Voltage-Max (Vsup)
3.465 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
2
3
Factory Lead Time
4 Weeks
Compare AS7C33256NTD32A-166TQIN with alternatives
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