AS7C33232F-7QC
vs
70V18L20PFGI
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALLIANCE SEMICONDUCTOR CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
|
| Package Description |
QFP, QFP100,.7X.9
|
TQFP-100
|
| Pin Count |
100
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.B
|
3A991.B.2.B
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
7 ns
|
20 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
|
| Memory Density |
1048576 bit
|
589824 bit
|
| Memory IC Type |
STANDARD SRAM
|
DUAL-PORT SRAM
|
| Memory Width |
32
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Number of Words |
32768 words
|
65536 words
|
| Number of Words Code |
32000
|
64000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
32KX32
|
64KX9
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP100,.7X.9
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
|
| Standby Current-Max |
0.004 A
|
|
| Standby Voltage-Min |
3 V
|
|
| Supply Current-Max |
0.25 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare AS7C33232F-7QC with alternatives
Compare 70V18L20PFGI with alternatives