AS7C33128NTD36A-200BC
vs
CXK77N36R160GB-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ALLIANCE SEMICONDUCTOR CORP
SONY CORP
Part Package Code
QFP
BGA
Package Description
LQFP,
BGA, BGA119,7X17,50
Pin Count
100
119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
1
Pbfree Code
Access Time-Max
1.5 ns
Additional Feature
IT CAN ALSO OPERATE WITH 2.5V NOMINAL SUPPLY
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
18874368 bit
Memory IC Type
LATE-WRITE SRAM
Memory Width
36
Number of Functions
1
Number of Terminals
119
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
512KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
2.4 mm
Standby Current-Max
0.16 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.55 mA
Supply Voltage-Max (Vsup)
2.63 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
14 mm
Compare AS7C33128NTD36A-200BC with alternatives
Compare CXK77N36R160GB-3 with alternatives