AS7C3256K32P-5BC vs MT55L256V32PB-7.5IT feature comparison

AS7C3256K32P-5BC Alliance Semiconductor Corporation

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MT55L256V32PB-7.5IT Micron Technology Inc

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA119(UNSPEC) BGA,
Pin Count 119 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 5 ns 4.2 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e1
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM ZBT SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX32 256KX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119(UNSPEC)
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Standby Voltage-Min 3 V
Supply Current-Max 0.25 mA
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 3 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 2
Length 22 mm
Seated Height-Max 2.4 mm
Terminal Pitch 1.27 mm
Width 14 mm

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Compare MT55L256V32PB-7.5IT with alternatives