AS7C3256A-12PC vs U634H256DK35G1 feature comparison

AS7C3256A-12PC Alliance Semiconductor Corporation

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U634H256DK35G1 Cypress Semiconductor

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP SIMTEK CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.3 DIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 35 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e3
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.445 mm 5.1 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 3 V
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 3
Pbfree Code Yes
Length 34.7 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare U634H256DK35G1 with alternatives