AS7C32098A-10TCNTR
vs
IS61WV12816EDBLL-10BLI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ALLIANCE MEMORY INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
TSOP2
Package Description
TSOP2,
TFBGA,
Pin Count
44
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
8 Weeks
Access Time-Max
10 ns
10 ns
JESD-30 Code
R-PDSO-G44
R-PBGA-B48
JESD-609 Code
e3/e6
Length
18.415 mm
8 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
44
48
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX16
128KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.4 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.8 mm
0.75 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
6 mm
Base Number Matches
1
1
Package Equivalence Code
BGA48,6X8,30
Peak Reflow Temperature (Cel)
260
Compare AS7C32098A-10TCNTR with alternatives
Compare IS61WV12816EDBLL-10BLI with alternatives