AS7C316096C-10BIN vs IS61WV20488FBLL-10TLI feature comparison

AS7C316096C-10BIN Alliance Memory Inc

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IS61WV20488FBLL-10TLI Integrated Silicon Solution Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ALLIANCE MEMORY INC INTEGRATED SILICON SOLUTION INC
Package Description LFBGA, TSOP2,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 20 Weeks 10 Weeks
Samacsys Manufacturer Alliance Memory Integrated Silicon Solution Inc.
Access Time-Max 10 ns 10 ns
JESD-30 Code R-PBGA-B48 R-PDSO-G44
Length 8 mm 18.41 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Width 6 mm 10.16 mm
Base Number Matches 1 1
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 10

Compare AS7C316096C-10BIN with alternatives

Compare IS61WV20488FBLL-10TLI with alternatives