AS7C31026A-10BI
vs
IS61LV6416-10BI
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ALLIANCE SEMICONDUCTOR CORP
INTEGRATED CIRCUIT SOLUTION INC
Part Package Code
BGA
Package Description
TFBGA, BGA48,6X8,30
FBGA, BGA48,6X8,30
Pin Count
48
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e0
Length
8 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
Number of Terminals
48
48
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX16
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Standby Current-Max
0.001 A
0.015 A
Standby Voltage-Min
2 V
3 V
Supply Current-Max
0.09 mA
0.21 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
Base Number Matches
1
2
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