AS7C31026-10TC
vs
K6R1016V1D-TC10
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ALLIANCE SEMICONDUCTOR CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
TSOP2
Package Description
TSOP2, TSOP44,.46,32
0.400 INCH, TSOP2-44
Pin Count
44
44
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
JESD-609 Code
e0
e0
Length
18.41 mm
18.41 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX16
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TSOP2
Package Equivalence Code
TSOP44,.46,32
TSOP44,.46,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.0005 A
0.005 A
Standby Voltage-Min
2 V
3 V
Supply Current-Max
0.15 mA
0.065 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3.15 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Time@Peak Reflow Temperature-Max (s)
30
Compare AS7C31026-10TC with alternatives
Compare K6R1016V1D-TC10 with alternatives