AS7C251MPFS18A-166TQCN vs MCM69R819AZP6 feature comparison

AS7C251MPFS18A-166TQCN Integrated Silicon Solution Inc

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MCM69R819AZP6 Motorola Semiconductor Products

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC MOTOROLA INC
Part Package Code QFP
Package Description LQFP, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
Pin Count 100
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 3 ns
Additional Feature PIPELINED ARCHITECTURE BYTE WRITE CONTROL; BOUNDARY SCAN
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e3 e0
Length 20 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type STANDARD SRAM LATE-WRITE SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.4 mm
Supply Voltage-Max (Vsup) 2.625 V 3.6 V
Supply Voltage-Min (Vsup) 2.375 V 3.15 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 4
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES

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