AS7C251MPFS18A-166TQCN
vs
MCM63R818FC3
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
LQFP,
|
BGA,
|
| Pin Count |
100
|
119
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
3.5 ns
|
1.5 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
|
| JESD-30 Code |
R-PQFP-G100
|
R-PBGA-B119
|
| JESD-609 Code |
e3
|
|
| Length |
20 mm
|
22 mm
|
| Memory Density |
18874368 bit
|
4718592 bit
|
| Memory IC Type |
STANDARD SRAM
|
LATE-WRITE SRAM
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
119
|
| Number of Words |
1048576 words
|
262144 words
|
| Number of Words Code |
1000000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1MX18
|
256KX18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
BGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
2.77 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
4
|
|
|
|
Compare AS7C251MPFS18A-166TQCN with alternatives
Compare MCM63R818FC3 with alternatives