AS7C181026LL-100BC vs K6F1016S4M-TB120 feature comparison

AS7C181026LL-100BC Alliance Semiconductor Corporation

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K6F1016S4M-TB120 Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA TSOP2
Package Description BGA, BGA48,6X8,30 TSOP2,
Pin Count 48 44
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 120 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-G44
JESD-609 Code e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX16 64KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TSOP2
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 4e-7 A
Standby Voltage-Min 1.2 V
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 1.95 V 3.3 V
Supply Voltage-Min (Vsup) 1.65 V 2.3 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Base Number Matches 1 1
Length 18.41 mm
Seated Height-Max 1.2 mm
Width 10.16 mm

Compare AS7C181026LL-100BC with alternatives

Compare K6F1016S4M-TB120 with alternatives