AS7C181026LL-100BC vs HY63V16100AR2-25 feature comparison

AS7C181026LL-100BC Alliance Semiconductor Corporation

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HY63V16100AR2-25 SK Hynix Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP SK HYNIX INC
Part Package Code BGA TSOP2
Package Description BGA, BGA48,6X8,30 TSOP2-R,
Pin Count 48 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 25 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-G44
JESD-609 Code e0 e6
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX16 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TSOP2-R
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 4e-7 A
Standby Voltage-Min 1.2 V
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 3 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN BISMUTH
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Base Number Matches 1 1
Alternate Memory Width 16
Length 18.41 mm
Number of Ports 1
Output Enable YES
Seated Height-Max 1.2 mm
Width 10.16 mm

Compare AS7C181026LL-100BC with alternatives

Compare HY63V16100AR2-25 with alternatives