AS7C1024B-20STI vs EDI88128CS25TI feature comparison

AS7C1024B-20STI Alliance Memory Inc

Buy Now Datasheet

EDI88128CS25TI Microsemi Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ALLIANCE MEMORY INC MICROSEMI CORP
Part Package Code TSOP1 DIP
Package Description 8 X 13.40 MM, STSOP1-32 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.B EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 25 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-CDIP-T32
JESD-609 Code e0
Length 11.8 mm 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSOP1 DIP
Package Equivalence Code TSSOP32,.56,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3.937 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Width 8 mm 10.16 mm
Base Number Matches 2 5
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AS7C1024B-20STI with alternatives

Compare EDI88128CS25TI with alternatives