AS6YB1M8-70BI
vs
IS32WV10008BLL-85B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ALLIANCE SEMICONDUCTOR CORP
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
6 X 8 MM, BGA-48
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
85 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
9 mm
8 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
PSEUDO STATIC RAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX8
1MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.35 mm
Supply Voltage-Max (Vsup)
2.2 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
2.3 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
7 mm
6 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
3
Terminal Finish
TIN LEAD
Compare AS6YB1M8-70BI with alternatives
Compare IS32WV10008BLL-85B with alternatives