AS6C1016-55BIN vs SCM6323AYJ10AR feature comparison

AS6C1016-55BIN Alliance Memory Inc

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SCM6323AYJ10AR Motorola Semiconductor Products

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ALLIANCE MEMORY INC MOTOROLA INC
Part Package Code BGA
Package Description TFBGA, BGA48,6X8,30 SOJ,
Pin Count 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 16 Weeks
Samacsys Manufacturer Alliance Memory
Access Time-Max 55 ns 10 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-J44
Length 8 mm 28.58 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA SOJ
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3.76 mm
Standby Current-Max 0.00002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL J BEND
Terminal Pitch 0.75 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm 10.16 mm
Base Number Matches 2 1
Number of Ports 1
Output Enable YES

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