AS5C2568C-35/IT
vs
HS9-65758RH-2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROSS COMPONENTS
INTERSIL CORP
Package Description
DIP, DIP28,.3
DFP, FL28,.5
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDIP-T28
R-XDFP-F28
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC
Package Code
DIP
DFP
Package Equivalence Code
DIP28,.3
FL28,.5
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.02 A
0.00025 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.15 mA
0.16 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
Total Dose
100k Rad(Si) V
Compare AS5C2568C-35/IT with alternatives