AS58C1001FS-25M vs AS58C1001SF-25/IT feature comparison

AS58C1001FS-25M Micross Components

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AS58C1001SF-25/IT Micross Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC MICROSS COMPONENTS
Part Package Code DFP DFP
Package Description DFP, DFP,
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 250 ns 250 ns
JESD-30 Code R-CDFP-F32 R-CDFP-F32
Length 20.955 mm 20.828 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified
Seated Height-Max 2.8956 mm 3.81 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 11.43 mm 11.049 mm
Base Number Matches 1 1
Write Cycle Time-Max (tWC) 10 ms

Compare AS58C1001FS-25M with alternatives

Compare AS58C1001SF-25/IT with alternatives