AS4C32M16SB-7BINTR
vs
TC59SM916AFTL-80
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ALLIANCE MEMORY INC
|
TOSHIBA CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.28
|
8542.32.00.28
|
| Factory Lead Time |
8 Weeks
|
|
| Date Of Intro |
2020-03-11
|
|
| Samacsys Manufacturer |
Alliance Memory
|
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
5.4 ns
|
6 ns
|
| Clock Frequency-Max (fCLK) |
143 MHz
|
125 MHz
|
| I/O Type |
COMMON/SEPARATE
|
COMMON
|
| Interleaved Burst Length |
1,2,4,8
|
1,2,4,8
|
| JESD-30 Code |
S-PBGA-B54
|
R-PDSO-G54
|
| Length |
8 mm
|
22.22 mm
|
| Memory Density |
536870912 bit
|
536870912 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
54
|
54
|
| Number of Words |
33554432 words
|
33554432 words
|
| Number of Words Code |
32000000
|
32000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
32MX16
|
32MX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TSOP2
|
| Package Equivalence Code |
BGA54,9X9,32
|
TSOP54,.46,32
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Refresh Cycles |
8192
|
8192
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Self Refresh |
YES
|
YES
|
| Sequential Burst Length |
1,2,4,8,FP
|
1,2,4,8,FP
|
| Standby Current-Max |
0.008 A
|
0.001 A
|
| Standby Voltage-Min |
3 V
|
|
| Supply Current-Max |
0.12 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
8 mm
|
10.16 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
TSOP2
|
| Package Description |
|
TSOP2, TSOP54,.46,32
|
| Pin Count |
|
54
|
| Additional Feature |
|
AUTO/SELF REFRESH
|
| JESD-609 Code |
|
e0
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare AS4C32M16SB-7BINTR with alternatives
Compare TC59SM916AFTL-80 with alternatives