AS4C32M16D1-5BCN
vs
MT46V32M16CV-5BLIT:J
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ALLIANCE MEMORY INC
|
MICRON TECHNOLOGY INC
|
Package Description |
TFBGA-60
|
TBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Factory Lead Time |
8 Weeks
|
|
Samacsys Manufacturer |
Alliance Memory
|
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
0.7 ns
|
0.7 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
Length |
13 mm
|
12.5 mm
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
DDR1 DRAM
|
DDR DRAM
|
Memory Width |
16
|
16
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
60
|
60
|
Number of Words |
33554432 words
|
33554432 words
|
Number of Words Code |
32000000
|
32000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
32MX16
|
32MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
TBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
60
|
Terminal Pitch |
|
1 mm
|
|
|
|
Compare AS4C32M16D1-5BCN with alternatives
Compare MT46V32M16CV-5BLIT:J with alternatives