AS4C32M16D1-5BCN vs IS43R16320F-6BLI feature comparison

AS4C32M16D1-5BCN Alliance Memory Inc

Buy Now Datasheet

IS43R16320F-6BLI Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ALLIANCE MEMORY INC INTEGRATED SILICON SOLUTION INC
Package Description TFBGA-60 TBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Factory Lead Time 8 Weeks 8 Weeks
Samacsys Manufacturer Alliance Memory Integrated Silicon Solution Inc.
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.7 ns 0.7 ns
Additional Feature AUTO/SELF REFRESH PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 13 mm 13 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32MX16 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 2 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 1 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AS4C32M16D1-5BCN with alternatives

Compare IS43R16320F-6BLI with alternatives