AS4C16M16S-6TAN
vs
K4S561632H-UP750
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ALLIANCE MEMORY INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
TSOP
Package Description
TSOP2,
TSOP2,
Pin Count
54
54
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Samacsys Manufacturer
Alliance Memory
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5.4 ns
5.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PDSO-G54
R-PDSO-G54
JESD-609 Code
e3/e6
Length
22.22 mm
22.22 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
54
54
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
16MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
PURE MATTE TIN/TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
10.16 mm
10.16 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Qualification Status
Not Qualified
Temperature Grade
INDUSTRIAL
Compare AS4C16M16S-6TAN with alternatives
Compare K4S561632H-UP750 with alternatives