AS27C256A-20ECAM/MIL
vs
5962-8606311YX
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROSS COMPONENTS
|
TELEDYNE E2V (UK) LTD
|
Part Package Code |
QFJ
|
QFJ
|
Package Description |
,
|
CERAMIC, LCC-32
|
Pin Count |
32
|
32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.71
|
8542.32.00.61
|
Base Number Matches |
1
|
3
|
Access Time-Max |
|
200 ns
|
JESD-30 Code |
|
R-CQCC-N32
|
Memory Density |
|
262144 bit
|
Memory IC Type |
|
UVPROM
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
32
|
Number of Words |
|
32768 words
|
Number of Words Code |
|
32000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
|
32KX8
|
Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
|
QCCN
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
CHIP CARRIER
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
MIL-STD-883
|
Supply Current-Max |
|
0.06 mA
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Form |
|
NO LEAD
|
Terminal Position |
|
QUAD
|
|
|
|
Compare AS27C256A-20ECAM/MIL with alternatives
Compare 5962-8606311YX with alternatives