AS27C256-25JXT
vs
AM27C256-255DE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
MICROSS COMPONENTS
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
Package Description
0.600 INCH, CERAMIC, DIP-28
DIP,
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
250 ns
250 ns
I/O Type
COMMON
JESD-30 Code
R-CDIP-T28
R-GDIP-T28
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.5 V
Qualification Status
Not Qualified
Seated Height-Max
5.8928 mm
5.588 mm
Standby Current-Max
0.0003 A
Supply Current-Max
0.025 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
2
Length
37.1475 mm
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