AR1100-I/MQ
vs
AR1100T-I/ML
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
5 X 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, QFN-20
|
5 X 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, QFN-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Factory Lead Time |
5 Weeks, 4 Days
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
ALSO OPERATES AT 5V SUPPLY
|
ALSO OPERATES AT 5V SUPPLY
|
| JESD-30 Code |
S-PQCC-N20
|
S-PQCC-N20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
5 mm
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC20,.20SQ,25
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
1
|
1
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare AR1100-I/MQ with alternatives
Compare AR1100T-I/ML with alternatives