AR02BTRC3Y3242 vs RP73F1E32K4BTDF feature comparison

AR02BTRC3Y3242 Token Electronics Industry Co Ltd

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RP73F1E32K4BTDF TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer TOKEN ELECTRONICS INDUSTRY CO LTD TE CONNECTIVITY LTD
Reach Compliance Code compliant unknown
ECCN Code EAR99
Construction Chip Rectangular
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method Tape, Paper TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.0625 W 0.063 W
Resistance 32400 Ω 32400 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 2 1
Package Description CHIP
Additional Feature HIGH PRECISION
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard MIL-STD-202

Compare AR02BTRC3Y3242 with alternatives

Compare RP73F1E32K4BTDF with alternatives