AR02BTRC3Y1181 vs RP73F1E1K18BTDG feature comparison

AR02BTRC3Y1181 Token Electronics Industry Co Ltd

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RP73F1E1K18BTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer TOKEN ELECTRONICS INDUSTRY CO LTD TE CONNECTIVITY LTD
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method Tape, Paper TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.0625 W 0.063 W
Resistance 1180 Ω 1180 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Package Description CHIP
HTS Code 8533.21.00.30
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard MIL-STD-202
Series RP73

Compare AR02BTRC3Y1181 with alternatives

Compare RP73F1E1K18BTDG with alternatives