APT5010JVRU3
vs
FQL40N50F
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
FAIRCHILD SEMICONDUCTOR CORP
|
Package Description |
ROHS COMPLIANT, ISOTOP-4
|
TO-264, 3 PIN
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
25 Weeks
|
|
Additional Feature |
AVALANCHE RATED
|
|
Avalanche Energy Rating (Eas) |
2500 mJ
|
1800 mJ
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
500 V
|
500 V
|
Drain Current-Max (ID) |
44 A
|
40 A
|
Drain-source On Resistance-Max |
0.1 Ω
|
0.11 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
R-XUFM-X4
|
R-PSFM-T3
|
Number of Elements |
1
|
1
|
Number of Terminals |
4
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
450 W
|
460 W
|
Pulsed Drain Current-Max (IDM) |
176 A
|
160 A
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Form |
UNSPECIFIED
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
3
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
TO-264
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
3LD; TO264; MOLDED; JEDEC VARIATION AA
|
HTS Code |
|
8541.29.00.95
|
JEDEC-95 Code |
|
TO-264AA
|
JESD-609 Code |
|
e3
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare APT5010JVRU3 with alternatives
Compare FQL40N50F with alternatives