Findchips: Compare APA750-BGG456I vs APA750-BGG456I

APA750-BGG456I vs APA750-BGG456I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	MICROSEMI CORP	MICROCHIP TECHNOLOGY INC
Package Description	BGA, BGA456,26X26,50	1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-456
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	180 MHz	180 MHz
JESD-30 Code	S-PBGA-B456	S-PBGA-B456
JESD-609 Code	e1	e1
Length	35 mm	35 mm
Moisture Sensitivity Level	3	3
Number of Equivalent Gates	750000	750000
Number of Inputs	356	356
Number of Logic Cells	32768	32768
Number of Outputs	356	356
Number of Terminals	456	456
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	750000 GATES	750000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA456,26X26,50	BGA456,26X26,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.54 mm	2.54 mm
Supply Voltage-Max	2.7 V	2.7 V
Supply Voltage-Min	2.3 V	2.3 V
Supply Voltage-Nom	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	35 mm	35 mm
Base Number Matches	1	1
Factory Lead Time		18 Weeks
Samacsys Manufacturer		Microchip
Packing Method		TRAY
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays